| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur. |
| Cryptographic issue in HLOS during key management. |
| Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware. |
| Memory corruption while processing finish_sign command to pass a rsp buffer. |
| Memory corruption when AP includes TID to link mapping IE in the beacons and STA is parsing the beacon TID to link mapping IE. |
| Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length. |
| Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer. |
| Memory corruption when Alternative Frequency offset value is set to 255. |
| Transient DOS when importing a PKCS#8-encoded RSA private key with a zero-sized modulus. |
| Transient DOS in Bluetooth Host while rfc slot allocation. |
| Memory corruption while using the UIM diag command to get the operators name. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |
| Information disclosure due to buffer over read in kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile |
